JPH0317222B2 - - Google Patents

Info

Publication number
JPH0317222B2
JPH0317222B2 JP17670884A JP17670884A JPH0317222B2 JP H0317222 B2 JPH0317222 B2 JP H0317222B2 JP 17670884 A JP17670884 A JP 17670884A JP 17670884 A JP17670884 A JP 17670884A JP H0317222 B2 JPH0317222 B2 JP H0317222B2
Authority
JP
Japan
Prior art keywords
cooling
liquid
fluorocarbon
pipe
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17670884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6154654A (ja
Inventor
Kishio Yokochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17670884A priority Critical patent/JPS6154654A/ja
Publication of JPS6154654A publication Critical patent/JPS6154654A/ja
Publication of JPH0317222B2 publication Critical patent/JPH0317222B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP17670884A 1984-08-27 1984-08-27 液冷装置 Granted JPS6154654A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17670884A JPS6154654A (ja) 1984-08-27 1984-08-27 液冷装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17670884A JPS6154654A (ja) 1984-08-27 1984-08-27 液冷装置

Publications (2)

Publication Number Publication Date
JPS6154654A JPS6154654A (ja) 1986-03-18
JPH0317222B2 true JPH0317222B2 (en]) 1991-03-07

Family

ID=16018364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17670884A Granted JPS6154654A (ja) 1984-08-27 1984-08-27 液冷装置

Country Status (1)

Country Link
JP (1) JPS6154654A (en])

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4419646B2 (ja) * 2004-03-30 2010-02-24 セイコーエプソン株式会社 光学装置およびプロジェクタ
US8061414B2 (en) 2004-12-22 2011-11-22 Tokyo University Of Science Educational Foundation Administrative Organization Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof
US20090260783A1 (en) 2006-03-06 2009-10-22 Tokyo University Of Science Educational Foundation Boil Cooling Method, Boil Cooling Apparatus, Flow Channel Structure and Applied Product Thereof
WO2016075838A1 (ja) * 2014-11-14 2016-05-19 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム、及び冷却方法
EP3279764A4 (en) * 2015-03-30 2018-12-05 Exascaler Inc. Electronic-device cooling system
JP6540230B2 (ja) 2015-05-26 2019-07-10 富士通株式会社 基板
WO2017037860A1 (ja) * 2015-08-31 2017-03-09 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム

Also Published As

Publication number Publication date
JPS6154654A (ja) 1986-03-18

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